US Patent No. 10,342,138

CHIP PART AND MANUFACTURING METHOD THEREOF


Patent No. 10,342,138
Issue Date July 02, 2019
Title Chip Part And Manufacturing Method Thereof
Inventorship Yasuhiro Kondo, Kyoto (JP)
Katsuya Matsuura, Kyoto (JP)
Hiroshi Tamagawa, Kyoto (JP)
Assignee ROHM CO., LTD., Kyoto (JP)

Claim of US Patent No. 10,342,138

1. A chip part comprising:a substrate having a first main surface on one side thereof and a second main surface on the other side thereof;
a functional device formed at a first main surface side of the substrate;
an external terminal formed at the first main surface side of the substrate and electrically connected to the functional device; and
a light diffusion reflection structure formed at a second main surface side of the substrate and diffusely reflecting light irradiated toward the second main surface of the substrate,
wherein the light diffusion reflection structure is formed by an uneven structure formed at the second main surface side of the substrate, and
the chip part further comprises an insulating film covering the second main surface of the substrate.