US Patent No. 10,342,137


Patent No. 10,342,137
Issue Date July 02, 2019
Title Fingerprint Module, Method For Manufacturing The Fingerprint Module, And Mobile Terminal
Inventorship Wenzhen Zhang, Dongguan (CN)
Assignee Guangdong Oppo Mobile Telecommunications Corp., Ltd., Dongguan (CN)

Claim of US Patent No. 10,342,137

1. A fingerprint module, comprising:a cover plate, a fingerprint chip, an intermediate board, and a circuit board;
wherein the cover plate defines an assembling region;
the fingerprint chip is fixed in the assembling region and has a plurality of pads;
the intermediate board is bonded to a surface of the fingerprint chip opposite to the cover plate to press the fingerprint chip to increase a bonding force between the fingerprint chip and the cover plate, so that there is a firm bonding between the fingerprint chip and the cover plate;
the fingerprint chip is electrically connected to the intermediate board via the pads;
the circuit board is electrically connected to the fingerprint chip via the intermediate board;
the pads are connected to the circuit board via different wires to ensure effective transmission of electrical signals of the fingerprint chip;
wherein the intermediate board comprises a first contact surface bonded to the fingerprint chip and a second contact surface opposite to the first contact surface, a plurality of first pins are electrically connected to the fingerprint chip and disposed on the first contact surface, the first pins are soldered to the pads, a plurality of second pins are electrically connected to the first pins and disposed on the second contact surface, and the circuit board is bonded to the second contact surface and electrically connected to the second pins; and
the circuit board comprises a first terminal and a second terminal, the first terminal is soldered to the second pins of the intermediate board, a connector is disposed at the second terminal, and the connector is pluggable into a main board of a mobile terminal.