US Patent No. 10,342,135

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE INCLUDING THE PRINTED CIRCUIT BOARD


Patent No. 10,342,135
Issue Date July 02, 2019
Title Printed Circuit Board And Manufacturing Method Thereof, And Semiconductor Package Including The Printed Circuit Board
Inventorship Seong Ryul Choi, Seoul (KR)
Suk Chang Hong, Yeongi-gun (KR)
Sang Kab Park, Cheongju (KR)
Kwang Seop Youm, Yeongi-gun (KR)
Assignee Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)

Claim of US Patent No. 10,342,135

1. A printed circuit board comprising:a first insulating layer forming one surface of a base substrate;
an embedded circuit pattern embedded in the first insulating layer and exposed through the one surface of the base substrate;
a second insulating layer comprising a circuit and laminated on the one surface of the base substrate and having a cavity formed therein, the second insulating layer being exposed through the cavity; and
a metal layer disposed on the one surface of the base substrate and exposed through an inner wall of the cavity,
wherein the metal layer is disposed on and abuts the surface of the base substrate, and the second insulating layer partially embeds the metal layer.