US Patent No. 10,342,134

PRINTED CIRCUIT BOARD AND A METHOD OF BONDING ELECTRODE LEAD OF BATTERY TO PRINTED CIRCUIT BOARD


Patent No. 10,342,134
Issue Date July 02, 2019
Title Printed Circuit Board And A Method Of Bonding Electrode Lead Of Battery To Printed Circuit Board
Inventorship Jin Oh Yang, Gyeongsangbuk-Do (KR)
Suk Jin Song, Gyeonggi-Do (KR)
Young Su Son, Chungcheongbuk-Do (KR)
Jae Young Jang, Chungcheongbuk-Do (KR)
Assignee LG Chem. Ltd., Seoul (KR)

Claim of US Patent No. 10,342,134

1. A printed circuit board configured to include a first surface and a second surface facing the first surface, the printed circuit board comprising:a board;
a plurality of connection parts on the board, each configured to be electrically connected with an electrode lead of a battery;
through holes each on one side of the board on a side from which the electrode lead of the battery is connected, each through hole passing through a respective one of the connection parts and through the board from the first surface to the second surface in a region in which the respective connection part is disposed;
guide holes each passing through a respective one of the connection parts and through the board from the first surface to the second surface in the region in which the respective connection part is disposed; and
a plurality of metal plates each soldered to a respective one of the connection parts and having an upper surface to which the electrode lead of the battery is bonded,
wherein at least one through hole and at least one guide hole pass through each connection part.