US Patent No. 10,342,130

STRUCTURE MOUNTED WITH ELECTRONIC COMPONENT


Patent No. 10,342,130
Issue Date July 02, 2019
Title Structure Mounted With Electronic Component
Inventorship Kiyoyuki Nakagawa, Nagaokakyo (JP)
Assignee MURATA MANUFACTURING CO., LTD., Kyoto (JP)

Claim of US Patent No. 10,342,130

1. A structure comprising:a wiring substrate;
an electronic component mounted on the wiring substrate via a solder joint material; wherein
the electronic component includes:
a body including a first principal surface and a second principal surface opposite to each other in a thickness direction, a first end surface and a second end surface opposite to each other in a length direction perpendicular or substantially perpendicular to the thickness direction, and a first side surface and a second side surface opposite to each other in a width direction perpendicular or substantially perpendicular to both the thickness direction and the length direction; and
a first external electrode and a second external electrode spaced from each other in the length direction; wherein
the first external electrode includes at least a first coating portion that covers a portion of the second principal surface located closer to the first end surface, a second coating portion that covers the first end surface, and a seventh coating portion that covers a portion of the first principal surface located closer to the first end surface;
the second external electrode includes at least a third coating portion that covers a portion of the second principal surface located closer to the second end surface, a fourth coating portion that covers the second end surface, and a tenth coating portion that covers a portion of the first principal surface located closer to the second end surface;
the wiring substrate includes:
a base including a principal surface; and
a first land and a second land on the principal surface and spaced from each other;
the electronic component includes the first coating portion opposed to the first land and the third coating portion opposed to the second land;
the solder joint material includes a first joint portion that joins the first external electrode and the first land, and a second joint portion that joins the second external electrode and the second land;
the first joint portion adheres to the first land, and adheres to the first external electrode so as to bridge between the first coating portion and the second coating portion;
the second joint portion adheres to the second land, and adheres to the second external electrode so as to bridge between the third coating portion and the fourth coating portion;
a maximum outside dimension of the electronic component is denoted by Lc in the length direction and Lc fulfills a condition of Lc?0.5 mm;
Lc is the longest exterior dimension of the electronic component;
a distance between the first coating portion and the third coating portion in the length direction is denoted by De, a distance between the first land and the second land in the length direction is denoted by Dl, and De and Dl fulfill a condition of 0.91?Dl/De?1.09;
the first joint portion adheres to and covers the seventh coating portion of the first external electrode, and/or the second joint portion adheres to and covers the tenth coating portion of the second external electrode; and
a dimension Lb in the length direction from an end of the first land on a side opposite to a position of the second land to an end of the second land on a side opposite to a position of the first land and the maximum outside dimension Lc of the electronic component in the length direction fulfills a condition of 1.00?Lb/Lc?1.32.