US Patent No. 10,342,128

DEPOSITING BULK OR MICRO-SCALE ELECTRODES


Patent No. 10,342,128
Issue Date July 02, 2019
Title Depositing Bulk Or Micro-scale Electrodes
Inventorship Kedar G. Shah, San Francisco, CA (US)
Satinderpall S. Pannu, Pleasanton, CA (US)
Vanessa Tolosa, Oakland, CA (US)
Angela C. Tooker, Dublin, CA (US)
Heeral J. Sheth, Oakland, CA (US)
Sarah H. Felix, Oakland, CA (US)
Terri L. Delima, Livermore, CA (US)
Assignee Lawrence Livermore National Security, LLC, Livermore, CA (US)

Claim of US Patent No. 10,342,128

1. A method of fabricating an implant device, comprising the steps of:depositing an electrically insulating polymer layer on a substrate,
depositing a conductive trace layer on said electrically insulating polymer layer wherein said conductive trace layer has a trace layer thickness,
depositing a bulk deposited electrode layer on a portion said conductive trace layer wherein said bulk deposited electrode layer has a bulk deposited electrode layer thickness and wherein said bulk deposited electrode layer thickness is thicker than said trace layer thickness,
thermocompressively bonding said bulk deposited electrode layer to said portion of said conductive trace layer using heat, pressure, and ultrasound,
depositing an encapsulating electrically insulating polymer layer on said conductive trace layer and said bulk deposited electrode layer,
removing at least a portion of said encapsulating electrically insulating polymer layer that covers said bulk deposited electrode layer exposing at least a portion of said bulk deposited electrode layer,
wherein the above steps produces the implant device, and
releasing the implant device from said substrate.