1. An electronic device comprising:a liquid crystal polymer (LCP) substrate;
a circuit layer on said LCP substrate and comprising at least one solder pad;
an LCP solder mask on said LCP substrate and having at least one aperture aligned with said at least one solder pad, said at least one aperture having a diameter of not greater than 0.002 inches, with the alignment having a positional accuracy of at least 0.001 inches;
said circuit layer being within said at least one aperture and being spaced apart from said LCP solder mask;
a fused seam between said LCP substrate and said LCP solder mask;
solder in the at least one aperture; and
at least one circuit component comprising at least one pin extending to and contacting said solder in the at least one aperture.