US Patent No. 10,342,125

MULTILAYER SUBSTRATE


Patent No. 10,342,125
Issue Date July 02, 2019
Title Multilayer Substrate
Inventorship Takahiro Baba, Nagaokakyo (JP)
Assignee MURATA MANUFACTURING CO., LTD., Kyoto (JP)

Claim of US Patent No. 10,342,125

1. A multilayer substrate comprising:a laminate including a plurality of dielectric layers laminated in a lamination direction, and a first surface and a second surface perpendicular or substantially perpendicular to the lamination direction;
a first signal conductor and a second signal conductor disposed at respective positions different in the lamination direction of the laminate;
a first external connection conductor and a second external connection conductor provided on the first surface;
a first wiring conductor that connects an end of the first signal conductor to the first external connection conductor;
a second wiring conductor that connects an end of the second signal conductor to the second external connection conductor;
the first signal conductor being disposed at a position closer to the first surface than the second signal conductor;
the first wiring conductor including a wiring adjusting portion having a length corresponding to a difference in distance between the first signal conductor and the second signal conductor in the lamination direction; and
an intermediate ground conductor for a wiring conductor, provided between the first wiring conductor and the second wiring conductor disposed at an identical position in the lamination direction.