US Patent No. 10,342,125


Patent No. 10,342,125
Issue Date July 02, 2019
Title Multilayer Substrate
Inventorship Takahiro Baba, Nagaokakyo (JP)

Claim of US Patent No. 10,342,125

1. A multilayer substrate comprising:a laminate including a plurality of dielectric layers laminated in a lamination direction, and a first surface and a second surface perpendicular or substantially perpendicular to the lamination direction;
a first signal conductor and a second signal conductor disposed at respective positions different in the lamination direction of the laminate;
a first external connection conductor and a second external connection conductor provided on the first surface;
a first wiring conductor that connects an end of the first signal conductor to the first external connection conductor;
a second wiring conductor that connects an end of the second signal conductor to the second external connection conductor;
the first signal conductor being disposed at a position closer to the first surface than the second signal conductor;
the first wiring conductor including a wiring adjusting portion having a length corresponding to a difference in distance between the first signal conductor and the second signal conductor in the lamination direction; and
an intermediate ground conductor for a wiring conductor, provided between the first wiring conductor and the second wiring conductor disposed at an identical position in the lamination direction.