US Patent No. 10,342,119

THERMAL SPRING FRAME AND SHIELD FOR SEALED PROCESSING SYSTEMS


Patent No. 10,342,119
Issue Date July 02, 2019
Title Thermal Spring Frame And Shield For Sealed Processing Systems
Inventorship Nermin Mujcinovic, Fremont, CA (US)
Assignee NIO USA, Inc., San Jose, CA (US)

Claim of US Patent No. 10,342,119

1. A compliant electronics assembly mount frame, comprising:a substrate including a substantially planar electronics assembly mount area, the substrate having a width and length;
a first mount flange formed in the substrate and disposed along a first side of the width of the substrate;
a second mount flange formed in the substrate and disposed along an opposite second side of the width of the substrate;
a first spring feature integrally formed in the substrate between the first mount flange and a periphery of the substantially planar electronics assembly mount area, wherein the first spring feature mechanically couples the first mount flange with the substantially planar electronics assembly mount area via a first compliant connection;
a second spring feature integrally formed in the substrate between the second mount flange and the periphery of the substantially planar electronics assembly mount area, wherein the second spring feature mechanically couples the second mount flange with the substantially planar electronics assembly mount area via a second compliant connection; and
a first localized force spring feature integrally formed from a first portion of material in the substrate and disposed inside the substantially planar electronics assembly mount area, wherein the first portion of material is bent in a direction outwardly away from the substantially planar electronics assembly mount area, and wherein the first portion of material is bent at a non-zero angle relative to a surface of the substantially planar electronics assembly mount area.