US Patent No. 10,342,118

SEMICONDUCTOR DEVICE


Patent No. 10,342,118
Issue Date July 02, 2019
Title Semiconductor Device
Inventorship Sensho Usami, Tokyo (JP)
Assignee LONGITUDE LICENSING LIMITED, Dublin (IE)

Claim of US Patent No. 10,342,118

1. A semiconductor device comprising:a wiring substrate;
a first semiconductor chip installed on one surface of the wiring substrate, the first semiconductor chip having a first edge and a second edge opposite to the first edge;
a second semiconductor chip stacked on the first semiconductor chip so that the second semiconductor chip crosses over the first edge and the second edge of the first semiconductor chip and a portion of a surface of the first semiconductor chip is exposed, wherein the second semiconductor chip is the top most semiconductor chip in the package:
a warp regulating member disposed directly on the exposed portion of the surface, wherein the warp regulating member comprises a first edge that aligns with the first edge of the first semiconductor chip and a second edge that aligns with the second edge of the first semiconductor chip and the warp regulating member covers a majority of the exposed portion of the surface: and
a sealing body formed on the wiring substrate to cover the first semiconductor chip, the second semiconductor chip, and the warp regulating member;
wherein the warp regulating member is a highly-resilient body having a modulus of elasticity higher than that of the sealing body.