1. A semiconductor device comprising:a wiring substrate;
a first semiconductor chip installed on one surface of the wiring substrate, the first semiconductor chip having a first edge and a second edge opposite to the first edge;
a second semiconductor chip stacked on the first semiconductor chip so that the second semiconductor chip crosses over the first edge and the second edge of the first semiconductor chip and a portion of a surface of the first semiconductor chip is exposed, wherein the second semiconductor chip is the top most semiconductor chip in the package:
a warp regulating member disposed directly on the exposed portion of the surface, wherein the warp regulating member comprises a first edge that aligns with the first edge of the first semiconductor chip and a second edge that aligns with the second edge of the first semiconductor chip and the warp regulating member covers a majority of the exposed portion of the surface: and
a sealing body formed on the wiring substrate to cover the first semiconductor chip, the second semiconductor chip, and the warp regulating member;
wherein the warp regulating member is a highly-resilient body having a modulus of elasticity higher than that of the sealing body.