US Patent No. 10,342,116

HIGH-FREQUENCY MODULE


Patent No. 10,342,116
Issue Date July 02, 2019
Title High-frequency Module
Inventorship Yoshihito Otsubo, Kyoto (JP)
Yoshihisa Masuda, Kyoto (JP)
Assignee MURATA MANUFACTURING CO., LTD., Kyoto (JP)

Claim of US Patent No. 10,342,116

1. A high-frequency module comprising:a wiring board;
a plurality of components mounted on a principal surface of the wiring board;
a sealing resin layer that is stacked on the principal surface of the wiring board, that has a step at an opposite surface of the sealing resin layer opposite to a surface of the sealing resin layer at a principal surface side of the wiring board, and that covers the plurality of components;
a groove that is formed in the sealing resin layer to intersect with the step when the wiring board is viewed in plan view, and that extends between a predetermined component and another component included in the plurality of components; and
a shield wall disposed in the groove and formed with a conductor,
wherein the groove includes, in a cross section taken in a direction perpendicular to the principal surface of the wiring board and in a direction intersecting with the groove, a first portion at the principal surface side of the wiring board, and a second portion at an opposite surface side of the sealing resin layer, the second portion being continuous from the first portion, and
wherein, in the cross section, an area of the second portion of the groove located at a higher portion side of the step is larger than an area of the second portion of the groove located at a lower portion side of the step.