US Patent No. 10,335,826

APPLYING FLUID TO A SUBSTRATE


Patent No. 10,335,826
Issue Date July 02, 2019
Title Applying Fluid To A Substrate
Inventorship Alex Veis, Kadima (IL)
Alex Davidson, Netanya (IL)
Assignee HP SCITEX LTD., Netanya (IL)

Claim of US Patent No. 10,335,826

1. A method of applying fluid in a desired pattern to a substrate, comprising:determining the desired pattern of fluid to be applied to the substrate;
controlling a first array of fluid applicators that extends across a width of a path of the substrate to apply fluid to the substrate to form a first portion of the pattern, wherein an applicator of the first array of fluid applicators spans a section of the substrate that includes portions of the substrate both in and out of the pattern, and wherein the controlling includes controlling the first array of fluid applicators to cause the applicator to not apply fluid to the section of the substrate; and
controlling a second fluid applicator to apply fluid to the portions of the substrate that the applicator of the first array of fluid applicators was not controlled to apply fluid during application of the fluid to form the first portion of the pattern, the second fluid applicator being separately movable from the first array of fluid applicators.