US Patent No. 10,251,307

COOLING DEVICE FOR ELECTRONIC COMPONENTS USING LIQUID COOLANT


Patent No. 10,251,307
Issue Date April 02, 2019
Title Cooling Device For Electronic Components Using Liquid Coolant
Inventorship Xavier Baillin, Crolles (FR)
Assignee

Claim of US Patent No. 10,251,307

1. A device for cooling at least one component, comprising:a support having a first face and a second face opposite the first face, the first face being configured to receive at least a component to be cooled, the support comprising a fluid network configured to circulate a liquid therein, the fluid network comprising a first cavity, a second cavity, and at least one first channel connecting the first cavity to the second cavity, a first deformable membrane and a second deformable membrane forming a mobile wall of the first cavity and a mobile wall of the second cavity, respectively,
the support further comprising an actuating device configured to actuate the first membrane and the second membrane, the actuating device being provided with actuation electrodes and being configured to enable deformation of the first and/or the second membrane so as to vary a volume of the first cavity and/or a volume of the second cavity and to enable displacement of the liquid in the at least one first channel; and
a thermal conducting element extending through the support and being disposed between a wall of the at least one first channel and the second face of the support, the thermal conducting element passing through a first material of the support and being in at least a second material, the first material having a first thermal conductivity, and the second material having a second thermal conductivity greater than the first thermal conductivity.