US Patent No. 10,251,306

WATER COOLING HEAT DISSIPATION STRUCTURE


Patent No. 10,251,306
Issue Date April 02, 2019
Title Water Cooling Heat Dissipation Structure
Inventorship Jung-Yi Chiu, New Taipei (TW)
Fu-Kuei Chang, New Taipei (TW)
Assignee ASIA VITAL COMPONENTS CO., LTD., New Taipei (TW)

Claim of US Patent No. 10,251,306

7. A water cooling heat dissipation structure, comprising:a first plate;
a second plate;
a plurality of heat dissipation members located between the first plate and the second plate and stacked together to form a water cooling heat dissipation body, each of the heat dissipation members having at least one groove extended therethrough and a plurality of turbulent areas provided therein; the at least one groove of the heat dissipation members being stacked to form at least one flow passage; respective turbulent areas of adjacent heat dissipation members being in contact with each other and stacked to form a plurality of turbulent sections located in the at least one flow passage; and one side of both the first and the second plates being respectively attached to a top and a bottom side of the water cooling heat dissipation body to secure two sides of the at least one flow passage;
a first connecting portion provided on one side of the water cooling heat dissipation body; and
a second connecting portion provided on another side of the water cooling heat dissipation body; the first and the second connecting portion being respectively provided on and communicable with two ends of the at least one flow passage of the water cooling heat dissipation body; and wherein each heat dissipation member has a plurality of first heat radiation fins; wherein the first plate has a first flow passage covering section and a plurality of second heat radiation fins; the first flow passage covering section having one side correspondingly connected to the top side of the water cooling heat dissipation body to secure the top side of the at least one flow passage.