US Patent No. 10,251,283

CARRIER-ATTACHED COPPER FOIL, LAMINATE, METHOD FOR PRODUCING PRINTED WIRING BOARD, AND METHOD FOR PRODUCING ELECTRONIC DEVICE


Patent No. 10,251,283
Issue Date April 02, 2019
Title Carrier-attached Copper Foil, Laminate, Method For Producing Printed Wiring Board, And Method For Producing Electronic Device
Inventorship Nobuaki Miyamoto, Ibaraki (JP)
Assignee

Claim of US Patent No. 10,251,283

1. A carrier-attached copper foil comprising a carrier, an interlayer, and an ultrathin copper layer in this order, wherein D2?D1 is 0.30 to 3.83 ?m, where D1 is the gravimetrically measured thickness of the carrier-attached copper foil excluding the carrier and the interlayer, and D2 is the maximum thickness of a layer remaining on a bismaleimide-triazine resin substrate in case of detaching the carrier after the carrier-attached copper foil is laminated to the resin substrate from the ultrathin copper layer side by being heat pressed under a pressure of 20 kgf/cm2 at 220° C. for 2 hours.