US Patent No. 10,251,278

MULTI-MATERIAL STRUCTURE WITH EMBEDDED ELECTRONICS


Patent No. 10,251,278
Issue Date April 02, 2019
Title Multi-material Structure With Embedded Electronics
Inventorship Mikko Heikkinen, Oulu (FI)
Jarmo Saaski, Kempele (FI)
Assignee TACTOTEK OY, Oulunsalo (FI)

Claim of US Patent No. 10,251,278

1. A method for manufacturing a multilayer structure for an electronic device, the method comprising: obtaining a flexible substrate film for accommodating electronics; printing a number of conductor traces on the flexible substrate film for electrically connecting electronic components with each other and/or a number of predefined areas on the flexible substrate; providing a number of electronic components on a first surface area of the flexible substrate film, wherein the flexible substrate film further comprises a second surface area adjacent to the first surface area; overmolding a first thermoplastic material to the number of electronic components and the related first surface area of the flexible substrate film accommodating the components; and overmolding a second thermoplastic material on the adjacent second surface area and on at least part of the first surface area so that at least part of the electronic components and the first thermoplastic material thereon are substantially embedded between the flexible substrate film and the second thermoplastic material, wherein the first thermoplastic exhibits a first elasticity and the second thermoplastic material exhibits a second, different elasticity; wherein the first thermoplastic material is configured to prevent the first surface area of the flexible substrate from deformation and the second thermoplastic material is configured to allow the flexible substrate to bendable.