US Patent No. 10,251,277

RESIN-SEALED MODULE


Patent No. 10,251,277
Issue Date April 02, 2019
Title Resin-sealed Module
Inventorship Shota Ishihara, Kyoto (JP)
Tetsuya Oda, Kyoto (JP)
Tatsunori Kan, Kyoto (JP)
Kenichi Atsuchi, Kyoto (JP)
Assignee MURATA MANUFACTURING CO., LTD., Kyoto (JP)

Claim of US Patent No. 10,251,277

1. A resin-sealed module having a plurality of circuit components sealed with a resin and mounted on a circuit substrate, comprising:a plurality of common land electrodes located on a first main surface of the circuit substrate, outer electrodes of the plurality of circuit components set at a same potential being connected to one of the common land electrodes,
each of the common land electrodes including:
a plurality of mounting sections linearly disposed in a same direction relative to an imaginary line connecting centers of opposing ones of the mounting sections, and
a bridge section disposed in an area where the mounting sections are opposed to each other so as to interconnect opposing ones of the mounting sections, wherein
one of the outer electrodes of each of the circuit components is connected to a corresponding one of the mounting sections on a one-to-one correspondence basis by using a solder, and
a portion of the bridge section disposed in the area where the mounting sections are opposed to each other is displaced in a direction perpendicular to the imaginary line connecting centers of opposing ones of the mounting sections.