US Patent No. 10,251,276

PRINTED CIRCUIT BOARD AND A METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD


Patent No. 10,251,276
Issue Date April 02, 2019
Title Printed Circuit Board And A Method For Producing A Printed Circuit Board
Inventorship Johannes Bock, Erlangen (DE)
Thomas Schmidt, Burglengenfeld (DE)
Bernhard Schuch, Neusitz (DE)
Assignee

Claim of US Patent No. 10,251,276

1. A printed circuit board for an electronic component, the printed circuit board comprising:an unpopulated circuit board;
an electrically insulating substrate;
a foil comprising an anti-adhesion coating, the foil arranged within the electrically insulating substrate;
a number of electrically conductive conductor tracks; and
at least one sensor dome having:
a sensor head arranged within the electrically insulating substrate, wherein the sensor head is arranged above the foil in relation to a vertical axis relative to a surface side of the electrically insulating substrate; and
a carrier body supporting the sensor head, the carrier body formed integrally with the electrically insulating substrate, the carrier body is cut out with a predefined contour encompassing a section surrounding the sensor head from the electrically insulating substrate, at least a part of the carrier body remains integrally connected to the electrically insulating substrate,
wherein the cut-out carrier body with the sensor head is positioned in a direction of the vertical axis,
wherein the sensor dome is positioned such that the cut-out carrier body with the sensor head is moved in the direction of the vertical axis relative to the surface side; and
a cover encapsulating the sensor dome.