US Patent No. 10,251,273

MAINBOARD ASSEMBLY INCLUDING A PACKAGE OVERLYING A DIE DIRECTLY ATTACHED TO THE MAINBOARD


Patent No. 10,251,273
Issue Date April 02, 2019
Title Mainboard Assembly Including A Package Overlying A Die Directly Attached To The Mainboard
Inventorship Damion Searls, Hillsboro, OR (US)
Weston C. Roth, Portland, OR (US)
Margaret D. Ramirez, Forest Grove, OR (US)
James D. Jackson, Beaverton, OR (US)
Rainer E. Thomas, Beaverton, OR (US)
Charles A. Gealer, Phoenix, AZ (US)
Assignee Intel Corporation, Santa Clara, CA (US)

Claim of US Patent No. 10,251,273

1. An assembly comprising:a mainboard having a first side and an opposing second side;
an integrated circuit die directly attached (DCA die) to the mainboard, the DCA die disposed on the first side of the mainboard and having a first space between the DCA die and the mainboard;
a package including an integrated circuit (IC) die and a package substrate, the IC die attached directly to the package substrate without an intervening substrate between the IC die and the package substrate, the package substrate attached directly to the mainboard by a plurality of interconnects, the package disposed on the first side of the mainboard and overlying at least a portion of the DCA die with a second space between the package and the DCA die; and
an underfill material layer filling the first space between the DCA die and the mainboard, filling the second space between the package and the DCA die, and surrounding the plurality of interconnects attaching the package to the mainboard;
wherein the mainboard includes at least one electrical path coupling the DCA die to the package and at least one other electrical path coupling the DCA die to an electrical terminal disposed on the mainboard, the electrical terminal to couple with another component.