US Patent No. 10,251,272

MICROELECTRONIC DEVICES DESIGNED WITH ULTRA-HIGH-K DIELECTRIC CAPACITORS INTEGRATED WITH PACKAGE SUBSTRATES


Patent No. 10,251,272
Issue Date April 02, 2019
Title Microelectronic Devices Designed With Ultra-high-k Dielectric Capacitors Integrated With Package Substrates
Inventorship Aleksandar Aleksov, Chandler, AZ (US)
Feras Eid, Chandler, AZ (US)
Thomas L. Sounart, Chandler, AZ (US)
Georgios C. Dogiamis, Chandler, AZ (US)
Johanna M. Swan, Scottsdale, AZ (US)
Assignee Intel Corporation, Santa Clara, CA (US)

Claim of US Patent No. 10,251,272

1. A microelectronic device comprising:a plurality of organic dielectric layers; and
a capacitor that is integrated with a first organic dielectric layer of the plurality of organic dielectric layers, and the capacitor includes first and second conductive electrodes and a plurality of vertically arranged ultra-high-k dielectric layers.