8. An electronic control device, comprising:at least a metal substrate;
at least a wiring formed on the metal substrate; and
at least a chip capacitor bonded to a part of the wiring with an electrically conductive bonding agent,
wherein a width of the wiring is at least twice as large as a width of the chip capacitor bonded to the wiring, a land section on which the electrically conductive bonding agent is arranged is formed on an end surface of the wiring, and a predetermined number of circular stress mitigation holes are arranged in a surrounding of the land section, the circular stress mitigation holes being structured to deform due to generation of thermal stress in the wiring to reduce the stress acted upon the electrically conductive bonding agent.