US Patent No. 10,251,270

DUAL-DRILL PRINTED CIRCUIT BOARD VIA


Patent No. 10,251,270
Issue Date April 02, 2019
Title Dual-drill Printed Circuit Board Via
Inventorship Yongming Xiong, Fremont, CA (US)
Assignee Innovium, Inc., San Jose, CA (US)

Claim of US Patent No. 10,251,270

1. A printed circuit board having multiple layers of circuitry, the printed circuit board comprising:a first layer having a first cylindrical opening with a first diameter, the first cylindrical opening formed through at least the first layer and formed about a particular axis;
a second layer having a second cylindrical opening with a second diameter, the second cylindrical opening formed through at least the second layer and formed about the particular axis,
wherein the first cylindrical opening is a portion of a conductive via, and
wherein the second diameter is smaller than the first diameter; and
a third layer having a third cylindrical opening with a third diameter, the third cylindrical opening formed through at least the third layer and formed about the particular axis,
wherein the third layer is arranged between the first layer and the second layer,
wherein the third diameter is smaller than the second diameter,
wherein the third cylindrical opening is a portion of the conductive via, and
wherein the second cylindrical opening is non-conductive.