US Patent No. 10,251,268


Patent No. 10,251,268
Issue Date April 02, 2019
Title Circuit Structure
Inventorship Arinobu Nakamura, Mie (JP)
Tou Chin, Mie (JP)
Assignee AutoNetworks Technologies, Ltd., Yokkaichi, Mie (JP) Sumitomo Wiring Syste...

Claim of US Patent No. 10,251,268

1. A circuit structure comprising:a substrate having a first face opposite of a second face, a conductive pattern having a first portion and a second portion, the first portion being disposed on the first face and the second portion being disposed on the second face;
a conductive member fixed to the second face of the substrate, the conductive member having a cut out portion; and
an electronic component that has a main portion, a first terminal electrically connected to the conductive member, a second terminal, and a first lead member, the first lead member electrically connecting the second terminal to the second portion of the conductive pattern, the second terminal and at least a portion of the first lead member are disposed within the cut out portion, and wherein a portion of the main portion overlaps the conductive member.