US Patent No. 10,251,266

WEARABLE FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME


Patent No. 10,251,266
Issue Date April 02, 2019
Title Wearable Flexible Printed Circuit Board And Method Of Manufacturing The Same
Inventorship In Yong Seo, Seoul (KR)
Assignee AMOGREENTECH CO., LTD., Gimpo-si (KR)

Claim of US Patent No. 10,251,266

1. A wearable flexible printed circuit board comprising:a base substrate made of a fiber web that is formed by accumulating spun fibers made of a fiber-forming polymer material and having a diameter of 3 ?m or less; and
a conductive circuit pattern formed on the base substrate,
wherein the fiber web has a plurality of pores; and
wherein the circuit pattern is formed on only fibers of the fiber web.