US Patent No. 10,251,265

PREGREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD


Patent No. 10,251,265
Issue Date April 02, 2019
Title Pregreg, Film With Resin, Metal Foil With Resin, Metal-clad Laminate, And Printed Wiring Board
Inventorship Akiko Kawaguchi, Tsukuba (JP)
Nozomu Takano, Tsukuba (JP)
Yasuyuki Mizuno, Chikusei (JP)
Kazumasa Takeuchi, Chikusei (JP)
Shigeru Haeno, Ichihara (JP)
Yoshinori Nagai, Ichihara (JP)
Masato Fukui, Chikusei (JP)
Assignee HITACHI CHEMICAL COMPANY, LTD., Tokyo (JP)

Claim of US Patent No. 10,251,265

1. A printed wiring board comprising at least a prepreg formed by impregnating a fiber base material with a resin composition, wherein:the resin composition comprises a thermosetting resin, a curing agent, and an acrylic resin obtained by polymerizing a monomer mixture, a mixing ratio of the thermosetting resin being 10-90 wt % with respect to the total solid portion of the resin composition,
the monomer mixture consisting of:
5-30 parts by weight of a compound represented by the following formula (1),

wherein R1 represents a hydrogen atom or a methyl group and R2 represents a C5-10 cycloalkyl or C6-13 cycloalkylalkyl group;
0.5-30 parts by weight of a functional group-containing monomer, the functional group comprising at least one of an acid anhydride group, an amino group, an amide group or an epoxy group; and
40-94.5 parts by weight of a third monomer that is copolymerizable with the functional group-containing monomer and the compound represented by formula (1) and has no nitrile groups in the structure, wherein the third monomer is at least one monomer selected from the group consisting of methyl acrylate, ethyl acrylate, n-propyl acrylate, i-propyl acrylate, n-butyl acrylate, i-butyl acrylate, t-butyl acrylate, pentyl acrylate, n-hexyl acrylate, 2-ethylhexyl acrylate, n-octyl acrylate, dodecyl acrylate, octadecyl acrylate, butoxyethyl acrylate, methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, i-propyl methacrylate, n-butyl methacrylate, i-butyl methacrylate, t-butyl methacrylate, pentyl methacrylate, n-hexyl methacrylate, 2-ethylhexyl methacrylate, n-octyl methacrylate, lauryl methacrylate, dodecyl methacrylate, octadecyl methacrylate, butoxyethyl methacrylate, 4-vinylpyridine, 2-vinylpyridine, ?-methylstyrene, ?-ethylstyrene, ?-fluorostyrene, ?-chlorostyrene, ?-bromostyrene, fluorostyrene, chlorostyrene, bromostyrene, methylstyrene, methoxystyrene and styrene,
the amounts of the compound represented by formula (1), the functional group-containing monomer and the third monomer combine to a total amount of 100 parts by weight, and
the ratio of the peak height near 2240 cm?1 due to nitrile groups (PCN) to the peak height near 1730 cm?1 due to carbonyl groups (PCO) in the IR spectrum of the cured resin composition (PCN/PCO) is no greater than 0.001.