US Patent No. 10,251,261

CIRCUIT STRUCTURE


Patent No. 10,251,261
Issue Date April 02, 2019
Title Circuit Structure
Inventorship Tou Chin, Mie (JP)
Arinobu Nakamura, Mie (JP)
Assignee AutoNetworks Technologies, Ltd., Yokkaichi, Mie (JP) Sumitomo Wiring Syste...

Claim of US Patent No. 10,251,261

1. A circuit structure comprising:a circuit substrate that has one surface on which a circuit pattern is formed;
a plurality of bus bars that constitute a power circuit and are fixed to the other surface of the circuit substrate with an interval therebetween;
an electronic component that straddles an interval between two of the bus bars that are adjacent to each other, and has a first terminal that is electrically connected to one of these bus bars and a second terminal that is electrically connected to the circuit pattern of the circuit substrate; and
a flexible sheet member that is fixed to the one bus bar to insulate the one bus bar and the second terminal from each other, while electrically connecting the second terminal and the circuit pattern to each other,
wherein the flexible sheet member includes:
an adhesive layer that is fixed to the one bus bar;
a terminal conductor foil piece that electrically connects the second terminal and the circuit pattern to each other; and
an insulating layer that is interposed between the adhesive layer and the terminal conductor foil piece and insulates the one bus bar and the terminal conductor foil piece from each other.