1. A heat dissipation and EMI shielding structure for at least one chip disposed on a substrate and comprising:a shielding frame having at least one opening to expose the chip, wherein the shielding frame includes a top plate and an enclosing sidewall extending downward from an outer periphery of a lower surface of the top plate toward the substrate: and
a heat dissipation element disposed on the shielding frame to cover the opening, wherein the shielding frame is in conjunction with the heat dissipation element to protect the chip from electromagnetic interference, and the heat dissipation element dissipates heat generated from the chip;
wherein the heat dissipation element includes an adhesive layer, and the adhesive layer is in contact with a top surface of the shielding frame and an upper surface of the chip; and
wherein the heat dissipation element is in sheet form and has enough flexibility and ductility so that the heat dissipation element is capable of being attached to the chip and the shielding frame even if there is a height difference of 0.2 mm between the top surface of the top plate and the upper surface of the chip;
wherein the height difference exists between the top surface of the top plate and the upper surface of the chip, and the heat dissipation element includes:
a first portion in contact with the upper surface of the chip;
a second portion connected to and surrounding the first portion; and
a third portion in contact with the top surface of the top plate and surrounding the second portion, wherein the second portion is inclinedly connected between the first portion and the third portion.