US Patent No. 10,244,629

PRINTED CIRCUIT BOARD INCLUDING MULTI-DIAMETER VIAS


Patent No. 10,244,629
Issue Date March 26, 2019
Title Printed Circuit Board Including Multi-diameter Vias
Inventorship Vittal Balasubramanian, San Jose, CA (US)
Yongming Xiong, Fremont, CA (US)
Assignee Innovium, Inc., San Jose, CA (US)

Claim of US Patent No. 10,244,629

1. An apparatus comprising:one or more connection elements that are configured to transfer signals; and
a printed circuit board (PCB) that includes:
a multilayer lamination of one or more ground layers, one or more power layers, and a plurality of signal layers,
a plurality of vias that pass through one or more layers of the multilayer lamination,
a plurality of traces that are distinct from the one or more connection elements, each trace of the plurality of traces being in contact with a respective via of the plurality of vias and being configured to transfer the signals,
a plurality of pads that are directly in contact with the one or more connection elements and that are configured to transfer the signals between the one or more connection elements and the plurality of traces,
wherein a first via of the plurality of vias includes:
a first portion that has a first diameter, and
a second portion that has a second diameter that is smaller than the first diameter,
wherein a second via of the plurality of vias includes:
a third portion that has a third diameter, and
a fourth portion that has a fourth diameter that is smaller from the third diameter,
wherein the first portion of the first via is adjacent to the fourth portion of the second via and the second portion of the first via is adjacent to the third portion of the second via,
wherein the one or more connection elements include:
a first element that is coupled to a first surface of the PCB, and
a second element that is coupled to a second surface of the PCB, the second surface being different from the first surface, and
wherein the first element includes a plurality of surface mount contacts that are respectively coupled to the plurality of pads.