US Patent No. 10,237,991

ELECTRONIC COMPONENT


Patent No. 10,237,991
Issue Date March 19, 2019
Title Electronic Component
Inventorship Nobuyuki Kondo, Yamato (JP)
Toshihiro Niitsu, Machida (JP)
Assignee Molex, LLC, Lisle, IL (US)

Claim of US Patent No. 10,237,991

1. An electronic component, comprising:a housing;
a conductive terminal loaded on the housing;
an external conductive member loaded on the housing; and
a thin film-like insulator provided on a surface of the external conductive member facing the conductive terminal,
wherein a first gap between the external conductive member and the conductive terminal is defined by a protrusion formed on the housing or the external conductive member, and wherein a second gap smaller than the first gap exists between the insulator and the conductive terminal.