US Patent No. 10,219,420

INTEGRATED CIRCUIT CHIP EXTRACTOR


Patent No. 10,219,420
Issue Date February 26, 2019
Title Integrated Circuit Chip Extractor
Inventorship Yongkang Hou, Beijing (CN)
Yu Zhang, Beijing (CN)
Jianlei Yang, Beijing (CN)
Assignee BOE TECHNOLOGY GROUP CO., LTD., (CN) HEFEI BOE OPTOELECTRONICS TECHNOLOGY ...

Claim of US Patent No. 10,219,420

1. An integrated circuit (IC) chip extractor for removing an IC chip from a panel, comprising a base plate and a heating head arranged on the base plate, wherein the heating head comprises a protrusion protruded from an end of the heating head and a hook arranged at an end of the protrusion, the hook is capable of being in contact with a bottom of a portion of the IC chip adjacent to a center of the panel;wherein delimiting struts are arranged on the base plate and are capable of abutting against an edge of the panel so as to enable the hook to be at a position corresponding to the IC chip.