US Patent No. 10,219,398

ELECTRONICS ENCLOSURE SYSTEMS AND METHODS


Patent No. 10,219,398
Issue Date February 26, 2019
Title Electronics Enclosure Systems And Methods
Inventorship Andrew S. Cromarty, Palo Alto, CA (US)
Jacob H. Neugass, Santa Cruz, CA (US)
Jasen Levoy, Santa Cruz, CA (US)
Assignee HEATHKIT COMPANY, INC., Santa Cruz, CA (US)

Claim of US Patent No. 10,219,398

1. An electronics enclosure assembly comprising:a sled comprising at least two bracket components and two corresponding skid components, said skid components and said bracket components comprised of one or a plurality of holes;
one or a plurality of enclosure fasteners having an attachment mechanism;
said holes of the skid components and bracket components each adapted to accept one of the attachment mechanisms of a corresponding one of the enclosure fasteners;
a housing comprised of a floor where said sled fits partially or wholly within said housing, said housing comprised of a plurality of holes in the floor adapted to permit the attachment mechanism of the enclosure fasteners to pass through; and
said skid component situated so as to reside between the bracket component and the floor of the housing when the sled is partially or fully inserted into the housing.