US Patent No. 10,219,391

SOLUTION AND PROCESS FOR THE PRE-TREATMENT OF COPPER SURFACES USING AN N-ALKOXYLATED ADHESION-PROMOTING COMPOUND


Patent No. 10,219,391
Issue Date February 26, 2019
Title Solution And Process For The Pre-treatment Of Copper Surfaces Using An N-alkoxylated Adhesion-promoting Compound
Inventorship Christian Sparing, Berlin (DE)
Thomas Huelsmann, Berlin (DE)
Arno Clicque, Berlin (DE)
Patrick Brooks, Berlin (DE)
Adrian Zee, Berlin (DE)
Heiko Brunner, Berlin (DE)
Assignee Atotech Deutschland GmbH, Berlin (DE)

Claim of US Patent No. 10,219,391

1. A method for pre-treating a copper surface, the method comprising:(A) contacting the copper surface with a first solution comprising:
a) hydrogen peroxide;
b) an acid; and
c) a nitrogen-containing, five-membered, heterocyclic compound; and
(B) contacting the copper surface with a second solution comprising a nitrogen-containing, adhesion-promoting compound selected from a lactam, amide or polyamide and that is connected at one or more of its nitrogen atoms with at least one residue of formula (I)

wherein:
n is an integer from 1 to 100;
R1 is hydrogen or a hydrocarbon residue with 1 to 6 carbon atoms;
R2 is hydrogen or a hydrocarbon residue with 1 to 6 carbon atoms; and
each R1 and R2 in a —(CHR1—CHR2—O)— moiety is selected independently of each R1 and R2 in another —(CHR1—CHR2—O)— moiety.