1. A method, comprising:forming one or more holes in a thick substrate using a laser drilling technique, wherein forming the one or more holes in the thick substrate comprises activating a first laser on a first side of the thick substrate and activating a second laser on a second side of the thick substrate, wherein an axis of the first laser is substantially coaxial with an axis of the second laser and each hole in the one or more holes has a diameter that is less than 100 ?m;
re-forming the one or more holes formed via the laser drilling technique via a mechanical process;
electroplating the one or more holes with a conductive material, wherein the conductive material does not completely fill the one or more holes; and
filling the one or more plated holes with a non-conductive material,
wherein the thick substrate comprises a dielectric layer having a thickness greater than or equal to 200 ?m.