1. A printed circuit board structure comprising;at least one insulation layer, at least one conductor layer, and at least one embedded component, wherein the at least one embedded component further comprises at least two connections, each of the at least two connections comprising a contact, an adhesion layer, and an outer barrier layer disposed on an outer surface of the adhesion layer, wherein in an area of the at least two connections of the embedded component the at least one insulation layer has at least one opening which extends to the outer barrier layer of the at least two connections, and
wherein the printed circuit board structure has at least two conductor paths that are connected to the at least two connections using vias which correspond to each of the at least two connections,
and each via runs from a conductor path directly to the outer barrier layer of the corresponding connection of the component, wherein the material of the barrier layer is selected from the group of nickel, nickel-vanadium, platinum, and cobalt,
characterized in that
the at least one opening is cleaned chemically, whereby the thickness of the barrier layer in the area of the at least one opening is reduced.