US Patent No. 10,219,383

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME


Patent No. 10,219,383
Issue Date February 26, 2019
Title Printed Wiring Board And Method For Manufacturing The Same
Inventorship Katsutoshi Kitagawa, Ogaki (JP)
Takema Adachi, Ogaki (JP)
Assignee IBIDEN CO. , LTD., Ogaki (JP)

Claim of US Patent No. 10,219,383

1. A printed wiring board, comprising:a laminate comprising a plurality of resin insulating layers and a plurality of conductor layers such that the resin insulating layers and the conductor layers are laminated alternately and that the laminate has a through hole opening to a first surface of the laminate and a component accommodating cavity configured to accommodate an electronic component and having an opening part formed on a second surface of the laminate on an opposite side with respect to the first surface,
wherein the through hole is formed through the laminate such that the through hole is extending to the component accommodating cavity, and the laminate has a resin coating formed on an inner wall surface of the through hole.