US Patent No. 10,219,380

ELECTRONIC DEVICE MODULE AND MANUFACTURING METHOD THEREOF


Patent No. 10,219,380
Issue Date February 26, 2019
Title Electronic Device Module And Manufacturing Method Thereof
Inventorship Do Jae Yoo, Suwon-Si (KR)
Jae Hyun Lim, Suwon-Si (KR)
Kyu Hwan Oh, Suwon-Si (KR)
Jong In Ryu, Suwon-Si (KR)
Assignee Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)

Claim of US Patent No. 10,219,380

1. An electronic device module comprising:a board including external connecting electrodes and mounting electrodes;
an electronic device mounted on the mounting electrodes;
a molded portion sealing the electronic device;
connection conductors each having an end bonded to a respective external connecting electrode and penetrating through the molded portion to an opposite end thereof having an external terminal bonded thereto; and
an insulating layer disposed between the board and the molded portion,
wherein the insulating layer covers the external connecting electrodes, surrounds the connection conductors adjacent to where the connection conductors are bonded to the external connection electrodes, and abuts stepped profile surfaces of the connection conductors.