US Patent No. 10,219,375

HYBRID CIRCUIT ASSEMBLY


Patent No. 10,219,375
Issue Date February 26, 2019
Title Hybrid Circuit Assembly
Inventorship Peter D. Morico, Sudbury, MA (US)
John D. Walker, Sudbury, MA (US)
Assignee RAYTHEON COMPANY, Waltham, MA (US)

Claim of US Patent No. 10,219,375

1. A method of manufacturing a hybrid circuit assembly, comprising:providing an integrated metal substrate (IMS), the IMS comprising a metal base plate including a recess formed in a first portion of an upper surface of the metal base plate, an insulating layer on a second portion of the upper surface of the metal base plate different from the first portion and adjacent to the recess, and a wiring layer on an upper surface of the insulating layer opposite the metal base plate, the wiring layer including a component mounting surface on a top surface of the wiring layer opposite the metal base plate;
providing a multi-layer wiring board (PWB), the PWB comprising conductive traces printed on two or more wiring layers separated by insulating material which include a bottom wiring layer with a bottom surface on one side of the PWB and a top wiring layer with a component mounting surface on an opposite side of the PWB;
attaching the PWB to the IMS within the recess of the metal base plate such that the bottom surface of the bottom wiring layer of the PWB is attached to a top surface of the recess and the component-mounting surface of the top wiring layer of the PWB is co-planar with the component-mounting surface of the wiring layer of the IMS.