US Patent No. 10,219,372


Patent No. 10,219,372
Issue Date February 26, 2019
Title Flexible Printed Board
Inventorship Yuki Ishida, Tokyo (JP)
Yusuke Nakatani, Sakura (JP)
Assignee FUJIKURA LTD., Tokyo (JP)

Claim of US Patent No. 10,219,372

1. A flexible printed board electrically connected to an electronic component by thermal compression bonding, the flexible printed board comprising:a flexible substrate;
a terminal portion formed on one surface of the flexible substrate and having a plurality of connection terminals to be connected to the electronic component;
a wire portion having a plurality of wires formed on an other surface of the flexible substrate located opposite to the one surface; and
a plurality of through wires formed inside through holes penetrating the flexible substrate in a compression bonding connection area of the terminal portion compression-bonded to the electronic component, the plurality of through wires connecting the connection terminals of the terminal portion to the respective wires of the wire portion,
the through wires being arranged in mutually different positions in a direction in which the plurality of connection terminals extend and a perpendicular thereto,
wherein the wire portion is formed such that the wires extend in a direction intersecting the connection terminals and such that the wires located between the connection terminals arranged adjacently to each other are equal in number in plan view for each pair of the connection terminals adjacent to each other in the area corresponding to the terminal portion, the number being equal to or more than one.