US Patent No. 10,219,371

WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF


Patent No. 10,219,371
Issue Date February 26, 2019
Title Wired Circuit Board And Producing Method Thereof
Inventorship Yuu Sugimoto, Osaka (JP)
Yoshito Fujimura, Osaka (JP)
Hiroyuki Tanabe, Osaka (JP)
Assignee NITTO DENKO CORPORATION, Osaka (JP)

Claim of US Patent No. 10,219,371

1. A wired circuit board comprising an insulating layer having an inclination face when viewed in a cross-sectional view of the wired circuit board, and a conductive pattern disposed on an upper face including the inclination face of the insulating layer,wherein the inclination face has a generally arc shape of a circle in a plan view of the wired circuit board,
the entire conductive pattern deviates from the center of the circle along the arc,
the conductive pattern has an inner circle portion that is disposed in at least the circle,
the insulating layer has a first flat face continued to the lower end of the inclination face, and
the inner circle portion is disposed at the first flat face.