US Patent No. 10,219,369

CIRCUIT BOARD


Patent No. 10,219,369
Issue Date February 26, 2019
Title Circuit Board
Inventorship Tatsuaki Denda, Nagano (JP)
Assignee SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-Shi (JP)

Claim of US Patent No. 10,219,369

1. A circuit board comprising:a rigid board including a first wiring layer formed on its upper surface side; and
a flexible board including a base material having flexibility and disposed on an upper surface side of the first wiring layer, a second wiring layer formed on the base material, and a via wiring formed in a through-hole passing through the second wiring layer and the base material,
wherein the via wiring has a protrusion protruding from an upper surface of the second wiring layer, and extending on and directly contacting the upper surface of the second wiring layer positioned on an outer circumferential side of the through-hole, and at an end portion of the through-hole positioned on a side of the protrusion of the via wiring, an edge portion of the upper surface of the second wiring layer is rounded.