US Patent No. 10,219,367

MULTILAYER RESIN SUBSTRATE, AND METHOD OF MANUFACTURING MULTILAYER RESIN SUBSTRATE


Patent No. 10,219,367
Issue Date February 26, 2019
Title Multilayer Resin Substrate, And Method Of Manufacturing Multilayer Resin Substrate
Inventorship Hirofumi Shinagawa, Nagaokakyo (JP)
Shigeru Tago, Nagaokakyo (JP)
Assignee MURATA MANUFACTURING CO., LTD., Kyoto (JP)

Claim of US Patent No. 10,219,367

1. A multilayer resin substrate comprising:a plurality of resin substrates that are laminated together;
an overlapping portion in which a signal line that is provided as a conductor pattern and another conductor pattern overlap each other in a laminating direction of the plurality of resin substrates;
a non-overlapping portion in which the signal line and the another conductor pattern do not overlap each other in the laminating direction of the plurality of resin substrates; and
a thin portion that is provided in the non-overlapping portion near the overlapping portion, the thin portion being a portion of the multilayer resin substrate which has a thickness smaller than a thickness of the plurality of resin substrates in the overlapping portion in the laminating direction of the plurality of resin substrates; wherein
the thin portion, in plan view in the laminating direction of the plurality of resin substrates, does not overlap the overlapping portion, and is defined by a plurality of recesses disposed along a direction in which the signal line extends or is defined by a plurality of recesses that extend continuously in the direction in which the signal line extends;
the thin portion is provided in only the plurality of resin substrates;
the plurality of recesses are provided in a top resin substrate or a bottom resin substrate of the plurality of resin substrates; and
the signal line and the another conductor pattern are not electrically connected to one another.