US Patent No. 10,214,829

CONTROL OF CURRENT DENSITY IN AN ELECTROPLATING APPARATUS


Patent No. 10,214,829
Issue Date February 26, 2019
Title Control Of Current Density In An Electroplating Apparatus
Inventorship Zhian He, Lake Oswego, OR (US)
Ashwin Ramesh, Beaverton, OR (US)
Shantinath Ghongadi, Tigard, OR (US)
Assignee Lam Research Corporation, Fremont, CA (US)

Claim of US Patent No. 10,214,829

1. A method for electroplating metal onto a substrate, the method comprising:(a) receiving the substrate in an electroplating chamber, wherein the substrate is a semiconductor substrate, and wherein a reference electrode comprising a dynamically changeable shape is provided in the electroplating chamber;
(b) immersing the substrate in an electrolyte in the electroplating chamber while changing the shape of the reference electrode from a first shape to a second shape; and
(c) electroplating metal onto the substrate while monitoring a potential difference between the substrate and the reference electrode.