US Patent No. 10,205,050

SEPARATING A WAFER OF LIGHT EMITTING DEVICES


Patent No. 10,205,050
Issue Date February 12, 2019
Title Separating A Wafer Of Light Emitting Devices
Inventorship Rao S. Peddada, San Jose, CA (US)
Frank Lili Wei, San Francisco, CA (US)
Assignee Lumileds LLC, San Jose, CA (US)

Claim of US Patent No. 10,205,050

1. A method of separating a wafer comprising a plurality of rows and columns of light emitting devices, the method comprising:dividing the wafer into a plurality of regions, each of the plurality of regions including at least one of the plurality of rows of light emitting devices and one or more features each having a known location in the wafer;
using the known locations of the one or more features to identify a best-fit line defining a border between each of the plurality of regions;
interpolating between adjacent best-fit lines to identify locations for dicing streets within each of the plurality of regions;
dividing a distance between Y-intercepts of the adjacent best-fit lines by a number of rows of LEDs between the adjacent best-fit lines to determine a distance between Y-intercepts of each of the dicing streets;
providing a plurality of dicing streets on the wafer such that a respective dicing street of the plurality of dicing streets is provided between each of the plurality of rows of light emitting devices on the wafer;
breaking the wafer along the plurality of dicing streets to separate the wafer in a pattern.