1. A method of separating a wafer comprising a plurality of rows and columns of light emitting devices, the method comprising:dividing the wafer into a plurality of regions, each of the plurality of regions including at least one of the plurality of rows of light emitting devices and one or more features each having a known location in the wafer;
using the known locations of the one or more features to identify a best-fit line defining a border between each of the plurality of regions;
interpolating between adjacent best-fit lines to identify locations for dicing streets within each of the plurality of regions;
dividing a distance between Y-intercepts of the adjacent best-fit lines by a number of rows of LEDs between the adjacent best-fit lines to determine a distance between Y-intercepts of each of the dicing streets;
providing a plurality of dicing streets on the wafer such that a respective dicing street of the plurality of dicing streets is provided between each of the plurality of rows of light emitting devices on the wafer;
breaking the wafer along the plurality of dicing streets to separate the wafer in a pattern.