1. A printed circuit board (PCB) having a blind plated through hole, the PCB manufactured by a method comprising:forming a first sub-composite core having a first core structure sandwiched between a first conductive layer and a second conductive layer, the first core structure including one or more dielectric layers and conductive layers;
forming a first via hole through the first core structure;
plating an inner surface of the first via hole with a conductive material to form a first plated via hole, wherein the first plated via hole electrically couples the first conductive layer to an internal layer or trace within the first core structure;
filling the first plated via hole with a conductive ink;
backdrilling the first plated via hole along a segment between the second conductive layer and the internal layer or trace to form a first blind plated through hole, wherein such backdrilling removes both the conductive material and conductive ink along the segment; and
laminating the second conductive layer of the first sub-composite core to a second sub-composite core.