US Patent No. 10,194,569


Patent No. 10,194,569
Issue Date January 29, 2019
Title Shield Cap And Method For Manufacturing The Same
Inventorship Toshiki Furutani, Ogaki (JP)
Takema Adachi, Ogaki (JP)
Hidetoshi Noguchi, Ogaki (JP)
Shota Tachibana, Ogaki (JP)
Assignee IBIDEN CO., LTD., Ogaki (JP)

Claim of US Patent No. 10,194,569

1. A shield cap for protecting an electronic component, comprising:a cap member having a side wall portion and a ceiling portion;
a metal layer formed on the side wall portion of the cap member; and
a conductive film formed on the cap member such that the conductive film is configured to shield electromagnetic waves,
wherein the ceiling portion comprises a resin material and a reinforcing material, the cap member is formed such that the side wall portion and the ceiling portion are forming an accommodation space configured to accommodate an electronic component, the side wall portion has a third surface facing the ceiling portion and a fourth surface on an opposite side with respect to the third surface, and the metal layer is formed on the fourth surface of the side wall portion.