1. A power conversion device comprising:a power semiconductor module comprising a power semiconductor element configured to convert a direct current into an alternating current; and
a flow channel formation body on which the power semiconductor module is disposed,
wherein the power semiconductor module comprises a high thermal conductor which is disposed at a position between the semiconductor element and the flow channel formation body, and a sealing material that seals the power semiconductor element and the high thermal conductor,
the high thermal conductor comprises a fin protruding toward the flow channel formation body at a side of the flow channel formation body, and
a portion of the sealing material that surrounds and does not cover the high thermal conductor and a leading edge of the fin are on a same plane.