US Patent No. 10,194,563


Patent No. 10,194,563
Issue Date January 29, 2019
Title Power Conversion Device
Inventorship Nobutake Tsuyuno, Tokyo (JP)
Eiichi Ide, Tokyo (JP)
Takeshi Tokuyama, Tokyo (JP)
Assignee HITACHI AUTOMOTIVE SYSTEMS, LTD, Hitachinaka-shi (JP)

Claim of US Patent No. 10,194,563

1. A power conversion device comprising:a power semiconductor module comprising a power semiconductor element configured to convert a direct current into an alternating current; and
a flow channel formation body on which the power semiconductor module is disposed,
wherein the power semiconductor module comprises a high thermal conductor which is disposed at a position between the semiconductor element and the flow channel formation body, and a sealing material that seals the power semiconductor element and the high thermal conductor,
the high thermal conductor comprises a fin protruding toward the flow channel formation body at a side of the flow channel formation body, and
a portion of the sealing material that surrounds and does not cover the high thermal conductor and a leading edge of the fin are on a same plane.