1. A method of making an electronic device comprising:forming a pair of circuit layers each comprising a plurality of solder pads on opposing major surfaces of a liquid crystal polymer (LCP) substrate;
forming a pair of LCP solder masks each having opposing first and second major surfaces and a plurality of mask openings extending therebetween;
forming at least one thin film resistor directly on the first major surface of each of the pair of the LCP solder masks; and
after forming at least one thin film resistor directly on the first major surface of each of the pair of LCP solder masks then coupling each of the pair of LCP solder masks to the opposing major surfaces of the LCP substrate so that each at least one thin film resistor is coupled to a respective one of the pair of circuit layers and so that each plurality of solder pads is aligned with a respective plurality of mask openings.