US Patent No. 10,194,536

METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A THIN FILM RESISTOR FORMED ON AN LCP SOLDER MASK AND RELATED DEVICES


Patent No. 10,194,536
Issue Date January 29, 2019
Title Method Of Making An Electronic Device Having A Thin Film Resistor Formed On An Lcp Solder Mask And Related Devices
Inventorship Louis Joseph Rendek, Jr., Melbourne, FL (US)
Assignee HARRIS CORPORATION, Melbourne, FL (US)

Claim of US Patent No. 10,194,536

1. A method of making an electronic device comprising:forming a pair of circuit layers each comprising a plurality of solder pads on opposing major surfaces of a liquid crystal polymer (LCP) substrate;
forming a pair of LCP solder masks each having opposing first and second major surfaces and a plurality of mask openings extending therebetween;
forming at least one thin film resistor directly on the first major surface of each of the pair of the LCP solder masks; and
after forming at least one thin film resistor directly on the first major surface of each of the pair of LCP solder masks then coupling each of the pair of LCP solder masks to the opposing major surfaces of the LCP substrate so that each at least one thin film resistor is coupled to a respective one of the pair of circuit layers and so that each plurality of solder pads is aligned with a respective plurality of mask openings.