US Patent No. 10,194,534

PRINTED WIRING BOARD, ELECTRONIC DEVICE, CATHETER, AND METALLIC MATERIAL


Patent No. 10,194,534
Issue Date January 29, 2019
Title Printed Wiring Board, Electronic Device, Catheter, And Metallic Material
Inventorship Hideta Arai, Ibaraki (JP)
Atsushi Miki, Ibaraki (JP)
Satoru Morioka, Tokyo (JP)
Assignee

Claim of US Patent No. 10,194,534

1. A printed wiring board comprising:one or more wires; and
one or more heat-generating components,
wherein the one or more wires satisfy, either partly or as a whole, at least one of the following conditions (A) to (C):
(A) the one or more wires include a rolled copper foil, either partly or as a whole,
(B) the one or more wires include, either partly or as a whole, a material having a thermal conductivity of 330 W/(m·K) or more, and
(C) the one or more wires include, either partly or as a whole, a material having an electrical conductivity of 88% IACS or more, and
wherein the one or more heat-generating components and the one or more wires are directly or indirectly connected to each other.