US Patent No. 10,194,533

METHODS OF LASER TRACE POST PROCESSING AND DEPANELING OF ASSEMBLED PRINTED CIRCUIT BOARDS


Patent No. 10,194,533
Issue Date January 29, 2019
Title Methods Of Laser Trace Post Processing And Depaneling Of Assembled Printed Circuit Boards
Inventorship Scott Arthur McMullen, Toronto (CA)
Peter Zosimadis, Toronto (CA)
Assignee SMART WAVE TECHNOLOGIES, INC., Bethesda, MD (US)

Claim of US Patent No. 10,194,533

1. A method for processing an assembled printed circuit board (PCBa) panel comprising the steps of:a) loading at least one PCBa panel containing a plurality of connected PCBa's into a processing device having a first and second laser, wherein each PCBa has a plurality of traces;
b) severing at least one trace on each PCBa using the first laser to individualize the PCBa's; and
c) depaneling the PCBa panel to separate the plurality of connected PCBa's using the second laser.