1. A manufacturing method of a thinned electronic product, comprising:forming a conductive circuit on a first surface of a supporting body, wherein the conductive circuit is made of a patterned conductive ink layer;
disposing an electronic element on the conductive circuit, wherein the electronic element is electrically connected to the conductive circuit; and
disposing a film layer on the conductive circuit having the electronic element, wherein the electronic element and the conductive circuit are wrapped between the supporting body and the film layer;
wherein the film layer is a single-layer or multi-layer structure, the film layer comprises a functional film layer formed by at least one layer selected from a group composed of a heat dissipation layer, a light guide layer, an external view ink layer, a waterproof layer, an adhesive layer, an electromagnetic wave shielding layer, a chemical resistant layer and a supporting layer, and wherein the supporting body is interposed between the conductive circuit and the functional film layer.